Thermal Grizzly TG Putty Advance 30G – Non-Conductive Thermal Pad Alternative, 0.2–3.0mm Gap Filler, GPU VRAM/VRM Use, Good Thermal Conductivity, Easy to Apply

Expert Features Designed for GPU Modding: Ideal for replacing thermal pads on graphics cards and adapting to various cooler configurations. High Flexibility: Easily molded into shape for precise application on components like VRAM, SMDs, and VRMs. Good Thermal Conductivity: TG Putty Advance delivers reliable thermal transfer for high-performance GPU cooling. Gap Filling Precision: Efficiently fills height differences from 0.2 mm to 3.0 mm, eliminating uneven contact issues. Electrically Non-Conductive: Safe to use around sensitive electronics with no risk of electrical shorts. Customizable Application: Apply using included spatulas for broad coverage or by hand (with gloves) for targeted spots. Scalable Usage: One 30g container is typically enough for most single or even high-end GPUs like the RTX 4090 (front-side). Alternative to Thermal Pads: Simplifies replacements by avoiding the need for multiple pad thicknesses. Temperature Resilient: Operates effectively in environments from -40°C to 120°C. Includes Tools: Comes with 3 spatulas for easy and controlled spreading. Not for CPUs or GPU Dies: Specifically engineered for PCB-to-cooler use cases—not suitable for direct die application. Clean Application Surface Required: For optimal results, clean surfaces thoroughly before applying (use TG Cleaning Wipes or isopropyl alcohol). Expert Specs Specification Details Product Name Thermal Grizzly TG Putty Advance Volume 30 grams Thermal Conductivity Good Electrical Conductivity Non-conductive Application Areas GPU VRAM, VRM, SMD – PCB to Cooler Gap Filling Gap Filler Range 0.2 mm to 3.0 mm Operating Temperature -40°C to 120°C Suitable For Graphics Cards Only (Not CPU or GPU die) Application Method By hand (gloves recommended) or spatula Tools Included 3x Spatulas Recommended Surface Prep Degreased and cleaned (TG Wipes / isopropanol)