Thermal Grizzly Minus Pad 8 | 100x100x0.5mm | High Thermal Conductivity | Compressible & Electrically Insulating | -100°C to 250°C | RoHS Compliant

Expert Features: Ultra-High Thermal Conductivity: Designed to fill microgaps between components, Minus Pad 8 offers excellent heat transfer efficiency for advanced cooling applications. Flexible & Compressible Surface: Built with a highly elastic and adaptable structure, allowing it to conform easily to uneven surfaces for optimal thermal contact. Premium Material Composition: Made from a ceramic silicon complex and nano aluminum oxide, ensuring long-term stability and consistent thermal performance. Electrically Insulating: Safely used around sensitive electronics, offering electrical insulation of 8 kV/mm, compliant with ASTM D149 standards. Wide Operating Temperature Range: Delivers reliable performance from -100°C up to 250°C, making it suitable for extreme environments. Eco-Friendly & RoHS Compliant: Manufactured with non-toxic, environmentally safe materials, aligning with RoHS standards for responsible tech use. Quick & Simple Installation: Requires only minimal pressure to apply—perfect for CPUs, GPUs, VRMs, RAM modules, and other high-temperature ICs. Non-Flammable (UL94 V-0 Rated): Engineered to resist ignition and flame propagation, adding another layer of system safety. Ideal for Pros: Trusted by PC builders, and thermal engineers for bridging thermal gaps where paste isn’t practical. Expert Specs: Specification Details Product Name Thermal Grizzly Minus Pad 8 Size 100 x 100 mm Thickness 0.5 mm Color Pink Thermal Conductivity Very High (Exact value depends on thickness) Material Composition Ceramic Silicon Complex Nano Aluminum Oxide Compressibility High Hardness Shore 00-60 Electrically Insulating Yes (8kV/mm, ASTM D149) Flammability Rating UL94 V-0 Operating Temperature -100°C to 250°C Installation Method Light pressure — adhesive-free RoHS Compliant Yes Application Use CPUs, GPUs, VRMs, Chipsets, Memory Modules